Capabilities:

StrataFLEX provides early stage technical support to allow system and device designers to solve interconnect design challenges utilizing the range of unique flex circuit attributes. Over the years we have taken over 1000 designs into production. As our capability evolves, in combination with our extensive experience, StrataFLEX will continue to offer unique and innovative flex interconnect solutions to our customers’ problems.

• Type I Flex - Single Sided - Single conductor layer laminated to dielectric providing point to point connection with access from either one or two sides. The choice for High Density Edge Connections (HDEC) applications.

• Type II Flex -  Double Sided - Two conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias, providing signal sequencing, ground, signal matching and high density interconnect.

• Type III Flex - Multilayer - Three or more conductor layers separated by laminated dielectric usually with plated through holes (PTH) vias., providing combinations of signal, power and ground in a high density interconnect configuration. This three dimensional package provides the complete electronic interconnect.

• Type IV Flex - Rigid flex - Three or more conductor layers separated by laminated dielectric,usually with plated through holes (PTH) vias. A versatile combination of both rigid and flexible technology to provide complete three dimensional capabilities for both commercial and military applications.

• Type V Flex - Multilayer (without plated through holes) Three or more conductors  separated by laminated dielectric with no plated through holes (PTH) vias. The multiple circuit layer provide sequencing and shielding capabilities with an economical cost connection method.

• Sculptured ® Flex - A combination of single or double sided with plated through holes (PTH) providing sculptured terminal pins built-in and extending beyond the boundary of the polyimide base material. These circuits can mate directly with solder terminations or plug directly into female sockets with an unlimited choice of contact configurations and finishes, including raised pads to interface with SMT requirements. Cost savings  are realized by eliminating the need for purchasing and attaching individual pins or connectors.

• Stiffeners - polymide rigid stiffeners, or heat sinks can be added.

• Fine Lines - presently to 4 mil (application dependent)

• Circuit Design - In-house Advanced Design and Layout Capabilities, which include schematic capture and signal integrity analyses tools.

• Concurrent Engineering - Services provide to ensure producible, cost effective designs.

• Laser Machining - Used for profiling circuits and removal of the dielectric cover layers. Reduces prototype and production costs by eliminating hard tooling costs.

• Turnkey / Quick -Turn - Design, prototype, pre and full rate production of FPC, FFC  manufacturing, assembly and test. Through hole and automatic placement of both active and passive devices, including full boxed build and ship to customer capabilities.